Press Photos

TDK-Micronas press photos

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TDK 发布适用于汽车和工业应用场景的全新 ASIL C 级杂散场 稳健型 3D HAL® 传感器

TDK 推出采用 3D HAL® 技术并具备模拟输出和 SENT 接口的位置传感器

TDK推出用于驱动无刷(BLDC)和有刷(BDC)电机的新型 2 A 峰值电流嵌入式电机控制器

TDK 推出用于高速电机应用场景的抗杂散磁场 ASIL C 级霍尔效应位置传感器系列

TDK introduces its next-generation embedded motor controller family HVC 5x

TDK推出下一代嵌入式电机控制器HVC 5x系列

TDK宣布其霍尔开关系列产品HAL 15xy升级到ASIL-B

TDK针对高安全要求的应用推出基于3D HAL®技术的带冗余功能的位置传感器

TDK推出具有冗余功能和数字输出接口的新型杂散场补偿3D HAL®传感器

TDK现推出带集成去耦电容器的杂散场稳健性3D HAL<sup>®</sup>位置传感器

TDK现推出带集成去耦电容器的杂散场稳健性3D HAL®位置传感器

TDK announces the ASIL-B upgrade of its 3D HAL® direct-angle sensor family HAL 37xy

TDK宣布已对3D HAL® HAL 37xy直角传感器系列进行了ASIL-B升级

TDK introduces flexible Multi-Hall-array sensor for high-precision current sensing


TDK expands embedded motor controller family to target high temperature environments

TDK 对嵌入式电机控制器系列进行了扩展,实现了对高温环境的适应

TDK发布SPC接口的新型抗杂散场3D HAL®位置传感器

TDK displays the latest in electronic solutions for embedded technologies at Embedded World 2020

带有杂散场补偿和SPI接口的3D位置霍尔传感器HAL® 3900

TDK unifies its sensor power at one single booth at the Sensor+Test 2019



TDK shows its product highlights for embedded technologies at Embedded World 2019

3D position Hall sensor product line with unique stray field compensation

ICSense new patent

ICsense files new patent on zero-leakage high-voltage analog switches

TDK presents their state-of-the-art product highlights for various facets of embedded technologies at Embedded World 2018


F.l.t.r.: Timo Knapp (Sales Automotive matronic), Stefan Guarino (Salesmanager matronic), Marcel Hennrich (Director Sales Europe TDK-Micronas), Christel Ritzenthaler (Salesmanager Europe TDK-Micronas), Jochen Knöbel (Application Support matronic), Arthur Eberle (Director matronic), Bernhard Huber (Vice President Sales and Industrial, TDK-Micronas)

TDK-Micronas和CGS就霍尔传感器产线编程器达成战略伙伴关系 (PR1703)

TDK-Micronas and Endrich expand their distribution partnership (PR1701)

Extended 扩展的霍尔开关系列产品将为您简化ISO 26262合规的系统解决方案



Micronas involved with two development projects of the Federal Ministry of Education and Research (BMBF)

ParsiFAL4.0 aims to make production sites and packaging more intelligent through microelectronic sensor systems in thin foils.

Micronas honored with “Quality Excellence Award 2016” from Denso

Koji Arima, President of Denso, presents the Quality Excellence Award 2016 to Wolfgang Bossinger, Vice President Quality at Micronas.

Micronas and GLYN expand their distribution partnership

Sealed by handshake – the expanded cooperation of Micronas and GLYN(photo f.l.t.r.: Marcel Hennrich, Micronas Director Sales Europe, Christel Ritzenthaler, Micronas Manager Sales Distribution Europe, Bernhard Huber, Micronas Vice President Sales and Industrial, Glyn Jones, GLYN Managing Director & Owner, Thomas Gerhardt, GLYN Managing Director, Mark Friedrichs, GLYN Product Manager Micronas)

Micronas presents sensor solution for multidimensional measurement with integrated decoupling capacitors

Micronas certificated for outstanding fire prevention

Stephan Schwegat hands over the certificate, f.l.t.r.: Joachim Weißenberg (Key Account Manager, AON), Stephan Schwegat (Head of the Trade/Industry Department, SV), Matthias Bopp (CEO, Micronas)

Dual-Die Hall sensors from Micronas combine multidimensional measurement with in-package redundancy (PR1511)

Regional Government Commissioner Bärbel Schäfer visiting Micronas in Freiburg (PR1509)


New HAR 24xy Dual-Die sensor family from Micronas brings in-package redundancy to Linear Hall-effect sensors (PR1501)

Micronas’ first ISO 26262 compliant, low-power Hall switch family in SOT23 package very well accepted in the market (PR1414)

Micronas’ new all-in-one controller family brings more flexibility for driving small electric motors (PR1413)

Micronas presents smallest integrated capacitor EMC-proof linear Hall sensor (PR1412)

Micronas Combined Heat and Power (CHP) Unit in operation – Another step towards "Green Industry Park North" (PR1409)

Brushless DC motor control solutions by Micronas migrating towards 0.18 micrometer high-voltage embedded flash CMOS process (PR1408)

Advanced 3D HAL® technology powers Micronas’ new sensor generation leading to superior angular accuracy (PR1407)

Micronas presents market’s first ISO 26262 compliant, low-power Hall switch family in SOT23 package (PR1405)

Micronas presents a new affordable USB kit for easy programming of its broad Hall-effect sensor portfolio (PR1403)

HAL 1002 - Micronas introduces the next generation of highest precision programmable Hall switches (PR1402)

Brushless DC motor control solutions by Micronas now additionally powered by ARM Cortex®-M3 Processor (PR1313)

Micronas builds combined heat and power unit at Freiburg site for the local generation of electric power, heat and cold (PR1312)

Micronas extends its successful HAL 24xy family of programmable linear Hall sensors with new package and interface variants (PR1310)

Micronas offers its 3D HAL® sensor families now also in leaded packages for use in automotive electronic systems (PR1308)

Micronas presents ESD-proof Linear Hall sensors of the latest generation for precise measurement of low magnetic fields (PR1307)

Micronas sets new milestone due to consistent quality policy (PR1303)

New sensor from Micronas uses proprietary 3D HAL® technology for direct angle detection from 0° up to 360° (PR1301)

PMDM-Minebea and Micronas announce their joint-collaboration on the HVC 2480B controller for DC motors with power transistors incorporated (PR1214)

Micronas presenting new programmable linear Hall sensor for more efficient position measurement (PR1213)

Micronas presents high-sensitivity current transducer for use in automotive and industrial applications (PR1212)

Micronas baut auf ihren Firmengebäuden in Freiburg eine 2.000 m² große Photovoltaik-Anlage mit Modulen der Freiburger Solar-Fabrik (PR1202)

Micronas fährt neue QFN-Package-Linie für Automotive- und Industrie-Produkte hoch (PR1207)

Micronas presents the GAS 86xyB – the smallest and most efficient multi-parametric sensor platform for gas detection (PR1209)

Micronas präsentiert neueste Sensor- und Aktuatorlösungen auf der SPS/IPC/DRIVES 2011 (PR1110)

You are here Home > Press Room > News > Micronas mit neuem Messeauftritt auf der SENSOR+TEST Messe (PR1104) Primary tabsView(active tab)EditTranslateNode export Micronas mit neuem Messeauftritt auf der SENSOR+TEST Messe (PR1104)

Micronas presenting new generation of Hall sensors for extended position measurement (PR1105)

Micronas showcases system solution for brushless DC motor control applications (PR1102)

Micronas set to enlarge its 3D Hall sensor family (PR1112)

Micronas now offers the successful HAL 880 linear Hall sensor in SMD package (PR1111)

New Linear Hall Sensors from Micronas offering cost benefits through preset sensitivity levels (PR1002)

Micronas supplying the 500 millionth linear Hall-effect sensor (PR1010)

Hall-effect current transducer for contactless AC/DC measurement in automotive and industrial applications (PR1009)

mySENS® – Micronas presents system solution with CMOS-based gas sensor technology at the Sensor+Test 2010 (PR1008)

Micronas showcases system solution for brushless DC motor control applications (PR1005)

Micronas and ihr GmbH announcing cooperation in LIN network solutions (PR1004)

Micronas current transducer family with digital output for automotive and industrial applications (PR1013)

Micronas and the University of Freiburg awarded the Research Prize for Chip-Integrated Fuel Cells (PR0913)

From left to right: Dr. Claas Müller, Mirko Frank,Dr. Gilbert Erdler, Prof. Holger Reinecke, Ingo Freund

Micronas presenting the smallest linear Hall sensor with integrated EEPROM (PR0912)

Micronas presenting first 3D Hall sensor (PR0909)

mySENS® – Micronas Announces Major Breakthrough In Gas Sensing Technology Based On Standard CMOS (PR0907)

Micronas Introduces Hall Sensors with New Temperature Ranges (PR0905)

Micronas opens on-line shop for automotive and industrial products (PR0904)

Micronas Introduces Solid-state Replacement for Micro Switches (0011)